The mobile Intel® GS45 Express Chipset , featuring the mobile Intel® Graphics Media Accelerator (GMA) 4500MHD, delivers
* Microsoft Windows Vista* Premium support with the highest level of Windows Aero* experience
* Blu-ray* logo capable HD video playback, with native support for Blu-ray* drives
* Great 3D graphics performance
* Intel® Clear Video Technology for excellent video quality
The mobile Intel® GS45 Express chipset features hardware based decoding for Blu-ray content, dual-channel DDR3 and DDR2 memory support, up to 1066 MHz system bus, PCI Express* x16 graphics ports and PCI Express x1 I/O ports, Serial ATA, and Hi-Speed USB 2.0 connectivity.
Architecture & Silicon Technology
Posted by
eintel
Architecture & Silicon Technology
In the age of Moore's Law, Intel has delivered architecture and silicon technology with amazing transistor counts—as many as two billion and growing. With steady gains in energy efficient performance, and innovative uses of new materials, our innovations continue to enable industry leading firsts.
Microarchitecture ›
Microarchitecture
By continuously introducing new microarchitectures, Intel is creating great leaps in energy efficient performance that enable new form factors at home, in the office, and on the go.
* Intel's smallest chip: Intel® Atom™ processor
* Nehalem: next-generation dynamically scalable microarchitecture
* Learn more about Intel® microarchitecture
Silicon technology ›
Silicon technology
Transforming the way we experience computing at the silicon level, Intel is developing new technologies that use innovative materials for ever smaller, faster, and more energy efficient processors and processor technology.
* The world's first 32nm logic technology
* New hafnium-based Intel® 45nm process technology
* Learn more about Intel® silicon technology
Tick-tock
Intel's tick-tock model is delivering rapid technology innovation on a reliable timeline.
* See how it works
Innovations for a healthier planet
Intel has moved to lead-free and halogen-free products for a healthier planet.¹
* Find out how
Moore's Law
Gordon Moore predicted the number of transistors to double about every two years.
* Discover Moore's Law
In the age of Moore's Law, Intel has delivered architecture and silicon technology with amazing transistor counts—as many as two billion and growing. With steady gains in energy efficient performance, and innovative uses of new materials, our innovations continue to enable industry leading firsts.
Microarchitecture ›
Microarchitecture
By continuously introducing new microarchitectures, Intel is creating great leaps in energy efficient performance that enable new form factors at home, in the office, and on the go.
* Intel's smallest chip: Intel® Atom™ processor
* Nehalem: next-generation dynamically scalable microarchitecture
* Learn more about Intel® microarchitecture
Silicon technology ›
Silicon technology
Transforming the way we experience computing at the silicon level, Intel is developing new technologies that use innovative materials for ever smaller, faster, and more energy efficient processors and processor technology.
* The world's first 32nm logic technology
* New hafnium-based Intel® 45nm process technology
* Learn more about Intel® silicon technology
Tick-tock
Intel's tick-tock model is delivering rapid technology innovation on a reliable timeline.
* See how it works
Innovations for a healthier planet
Intel has moved to lead-free and halogen-free products for a healthier planet.¹
* Find out how
Moore's Law
Gordon Moore predicted the number of transistors to double about every two years.
* Discover Moore's Law
Multi-core technology ›
Posted by
eintel
Developing new levels of system intelligence, energy efficiency, and processing performance, Intel® multi-core technology enables improved computing experiences while paving the way for to the evolution of tera-scale computing.
* Intel® multi-core technology
¹ 45nm products are manufactured on a lead-free process. Lead-free per EU RoHS directive July, 2006. Some E.U. RoHS exemptions may apply to other components used in the product package. Residual amounts of halogens are below November, 2007 proposed IPC/JEDEC J-STD-709 standards.
65nm CPU products have 95% of the lead solder content (by weight) removed from flip-chip package - E.U. RoHS Compliant.
* Intel® multi-core technology
¹ 45nm products are manufactured on a lead-free process. Lead-free per EU RoHS directive July, 2006. Some E.U. RoHS exemptions may apply to other components used in the product package. Residual amounts of halogens are below November, 2007 proposed IPC/JEDEC J-STD-709 standards.
65nm CPU products have 95% of the lead solder content (by weight) removed from flip-chip package - E.U. RoHS Compliant.
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